Thermally conductive materials

Mostra Nascondi Filtri

Showing 1–20 of 46 results

  • DOWSIL™ 3-6753 Thermally Conductive Adhesive
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    DOWSIL™ 3-6753 Thermally Conductive Adhesive
    • Mixing ratio: 1 to 1
    • Highly fluent
    • Self-leveling
    • Versatile thermal polymerization
    • Ensures heat flow away from components
    • With 7 mil glass microspheres
    • Check the thickness of the adhesion line
    • Without added solvents
  • DOWSIL™ 340 Heat Sink Compound
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    DOWSIL™ 340 Heat Sink Compound
    • Not smooth
    • Moderate thermal conductivity
    • Does not require ovens or curing
    • Heat flow away from circuit components can increase reliability
  • DOWSIL™ 3810 EG
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    DOWSIL™ 3810 EG
    • One-part dielectric gel
    • Transparent
    • Hot polymerization
    • Low viscosity
    • Very soft gel
    • Suitable for PCB potting and electronic component protection
    • Electrical insulation and environmental protection
    • Extended temperature range (-60°C / +200°C)
    • No mixing required
  • DOWSIL™ 4535
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    DOWSIL™ 4535
    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
  • DOWSIL™ 5351
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    DOWSIL™ 5351
    • Non-curing
    • High thermal conductivity
    • Stable on vertical surfaces
    • Gap filling capacity up to 1.0 mm
    • Thermally conductive silicone material
    • Low thermal resistance and good high-temperature stability
  • DOWSIL™ 5515
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    DOWSIL™ 5515
    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing
  • DOWSIL™ 5888
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    DOWSIL™ 5888
    • Non-curing
    • High thermal conductivity
    • Low thermal resistance
    • Solvent-free formulation
    • Thixotropic - low flowability
    • Applicable via screen printing, stencil or dispensing
    • Ability to achieve thin thicknesses
  • DOWSIL™ CC 2588
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    DOWSIL™ CC 2588
    • Medium viscosity
    • Abrasion-resistant elastoplastic surface
    • Solvent-based coating
    • High solid content
    • UV indicator for inspection
    • Room temperature vulcanization (RTV)
    • Good adhesion on rigid and flexible PCBs
  • DOWSIL™ CC 8030 UV
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    DOWSIL™ CC 8030 UV
    • Low viscosity, spray applicable
    • Fast UV cure with secondary moisture cure
    • Solvent-free
    • UV indicator for inspection
    • Good adhesion to PCB materials
    • Reduced oxygen inhibition
  • DOWSIL™ EA-9189 H White RTV Adhesive
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    DOWSIL™ EA-9189 H White RTV Adhesive
    No mixing required No reaction exotherm during curing Excellent primerless adhesion on many substrates Excellent performance across a wide temperature range Cures into soft, low-stress elastomers Controlled volatility (controlled silane migration)
  • DOWSIL™ EC-8425
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    DOWSIL™ EC-8425
    • High electrical conductivity (silver-based filler)
    • Electromagnetic shielding (EMC) over a wide frequency range
    • High elongation for stress relief (>20%)
    • Non-slump adhesive (non-flowable)
    • UV traceability for inspection
    • Good adhesion on various substrates
    • Solvent-free formulation
  • DOWSIL™ MS-1002 Moldable Silicone
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    DOWSIL™ MS-1002 Moldable Silicone
    • Two-component 1:1 optical silicone
    • Molding resin for optical applications
    • High light transmittance
    • Low chromatic dispersion
    • UV and heat resistant
    • High surface detail replication
    • High Shore A
    • Fast heat curing
  • DOWSIL™ SC 102 Compound
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    DOWSIL™ SC 102 Compound
    • Moderate thermal conductivity
    • One part: no ovens or curing required
    • Pulls heat away from critical components
  • DOWSIL™ SE 4420
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    DOWSIL™ SE 4420
    • Polymerization at room temperature
    • Good adhesion on various substrates
    • Fast tack-free time
    • Elastomeric material with high elongation
    • Suitable for bonding, sealing and thermal dissipation
    • Good mechanical strength
  • DOWSIL™ SE 4486 Thermally Conductive Adhesive
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    DOWSIL™ SE 4486 Thermally Conductive Adhesive
    • One-component adhesive
    • Thermally conductive
    • Polymerizes with moisture
    • Fast drying to the touch
    • Good adhesion
    • Self-leveling
    • Controlled volatility (controlled migration of silanes)
  • DOWSIL™ SE 9184 RTV Adhesive
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    DOWSIL™ SE 9184 RTV Adhesive
    • Rapid polymerization in RT, without notches
    • Not smooth
    • Higher thermal conductivity
    • Controlled volatility of silicone
    • No mixing required
    • Polymerization at room temperature
    • Faster processing at room temperature
    • Used if increased flame resistance is required
  • DOWSIL™ TC-2035 Thermally Conductive Adhesive
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    DOWSIL™ TC-2035 Thermally Conductive Adhesive
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
  • DOWSIL™ TC-4025 Dispensable Thermal Pad
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    DOWSIL™ TC-4025 Dispensable Thermal Pad
    • Can be used as a printable PAD
    • Can replace the traditional manufactured pad
    • Use as a gap filler
    • Dispensed or printed through manual or automated processes
    • Deposit of features for precise coverage of components
    • Lower cost of ownership than manufactured pads
    • Excellent thermal performance
    • Soft, stress-relieving and shock-dampening
    • Reworkable
  • DOWSIL™ TC-4515 Gap Filler A&B
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    DOWSIL™ TC-4515 Gap Filler A&B
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
  • DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
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    DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
    • Polymerization at room temperature
    • Long-term performance stability up to 150°C
    • Low compression stress
    • Maintains upright position (cured or uncured state)
    • Controlled volatility of silicone