The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Two-component adhesive sealant
    • Rapid polymerization at room temperature
    • Neutral alkoxide polymerization
    • Pasty, non-self-levelling consistency
    • Good and durable adhesion
    • Excellent weather, UV and heat resistance up to 190°C
    • Rapid curing allows rapid handling of bonded components
    • Deep polymerization
    • Two-component adhesive sealant
    • Rapid polymerization at room temperature
    • Neutral alkoxide polymerization
    • Pasty, non-self-levelling consistency
    • Good and durable adhesion
    • Excellent weather, UV and heat resistance up to 190°C
    • Rapid curing allows rapid handling of bonded components
    • Deep polymerization
    • Fast and homogeneous deep polymerization
    • Early adhesion at room temperature
    • Pasty, non-self-levelling consistency
    • Rapid handling of bonded components
    • Fast assembly process
    • Durable adhesion to a wide variety of substrates
    • Excellent resistance to weathering and U.V. rays.
    • High electrical conductivity (silver-based filler)
    • Electromagnetic shielding (EMC) over a wide frequency range
    • High elongation for stress relief (>20%)
    • Non-slump adhesive (non-flowable)
    • UV traceability for inspection
    • Good adhesion on various substrates
    • Solvent-free formulation
    • Meets BS 476 Part 22 standard
    • Excellent primerless adhesion on most substrates
    • porous and non-porous buildings
    • It does not drip
    • Joint movement capacity ±50%
    • Neutral curing system
    • Halogen-free
    • Complies with ISO 11600-F&G-25LM Standard
    • A fire resistance value of up to 4 hours can be obtained
    • Extensively tested on many European specifications
    • Out of footprint in 1.5 hours
    • Excellent weathering characteristics, including resistance to ozone, UV radiation and extreme temperatures
    • Long service life
    • CE marked as fire resistant according to ETAG 026
    • One-component clear primer
    • Dispersed in naphtha
    • Improves adhesion of RTV and thermosetting silicones to many substrates
    • Can be used on most substrates
    • Improves the adhesion of RTV and thermosetting silicones
    • Improves the adhesion of many wet-cure RTV silicones
    • Improves the adhesion of RTV and thermoset silicones to substrates
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Good adhesion on many substrates
    • Rapid handling of bonded components: rapidly develops adhesive strength at room temperature, enabling rapid handling of components.
    • Adheres to suitably prepared polypropylene.
    • Two-component system with 10:1 mixture ratio by weight. Non-corrosive and low-odor curing.
    • It contains no solvents.
    • The non-lumpy nature of the mixture allows the extruded bead to remain in place without flowing.
    • Excellent resistance to weathering, UV rays and heat up to 190°C.
    • Available in two color versions: Gray (RAL 7038) and Black (RAL 7016).
    • Superior sealing characteristics when exposed to fuels and oils
    • Easily injected and reinjected
    • Does not harden
    • Good grip
    • Essentially unaffected by shock, vibration, and thermal cycling
    • Contains no hardeners or curing agents
    • Withstands immersion in fuels and exposure to fuel vapors at temperatures up to +200°C
    • Contains flow control particles
    • Excellent flow characteristics allow faster injection at lower pressures.
    • Cleaning solvent
    • Contains a special catalyst for adhesion preparation
    • Easy to apply
    • Ready to use
    • Cleaning and surface preparation in one step
    • Increased security
    • Polymerization at room temperature
    • Good adhesion on various substrates
    • Fast tack-free time
    • Elastomeric material with high elongation
    • Suitable for bonding, sealing and thermal dissipation
    • Good mechanical strength
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Good adhesion on many substrates
    • High-temperature structural epoxy adhesive
    • Two-component epoxy adhesive
    • Service up to 149°C (300°F)
    • High shear strength on metals and composites
    • Thixotropic gap-filling paste
    • Contains 125-micron spacer beads
    • High Tg
    • High-strength structural epoxy adhesive
    • High shear and peel strength
    • Gap-filling with thixotropic behavior
    • Polymerization at room temperature
    • Fast handling strength
    • Good performance retention after environmental aging and chemical immersion
    • SVHC-free according to REACH
    • Structural applications
    • Room temperature curing paste
    • High toughness and resilience
    • Syntactic structural epoxy adhesive
    • Single-component supplied frozen
    • Paste consistency after thawing
    • Extrudable with standard equipment
    • Designed for structural applications on honeycomb
    • Two-component structural epoxy adhesive
    • Low-density syntactic formulation
    • Good mechanical strength-to-density ratio
    • Suitable for structural applications
    • Low density syntactic epoxy adhesive
    • Flame retardant and self-extinguishing
    • Extrudable but non-sagging after application
    • Fast curing at room temperature
    • Suitable for potting inserts in honeycomb structures