Industrial adhesives

Mostra Nascondi Filtri

Showing 181–200 of 296 results

  • DOWSIL™ PR-1200 RTV Prime Coat
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    DOWSIL™ PR-1200 RTV Prime Coat
    • One-component clear primer
    • Dispersed in naphtha
    • Improves adhesion of RTV and thermosetting silicones to many substrates
    • Can be used on most substrates
  • DOWSIL™ PR-1204 RTV Prime Coat
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    DOWSIL™ PR-1204 RTV Prime Coat
    • Improves the adhesion of RTV and thermosetting silicones
    • Improves the adhesion of many wet-cure RTV silicones
  • DOWSIL™ PR-2260 Prime Coat
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    DOWSIL™ PR-2260 Prime Coat
    • Improves the adhesion of RTV and thermoset silicones to substrates
  • DOWSIL™ Q3-1566 Heat Resistant Adhesive/ Sealant
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    DOWSIL™ Q3-1566 Heat Resistant Adhesive/ Sealant
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Good adhesion on many substrates
  • DOWSIL™ Q3-3526 Base and Catalyst
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    DOWSIL™ Q3-3526 Base and Catalyst
    • Rapid handling of bonded components: rapidly develops adhesive strength at room temperature, enabling rapid handling of components.
    • Adheres to suitably prepared polypropylene.
    • Two-component system with 10:1 mixture ratio by weight. Non-corrosive and low-odor curing.
    • It contains no solvents.
    • The non-lumpy nature of the mixture allows the extruded bead to remain in place without flowing.
    • Excellent resistance to weathering, UV rays and heat up to 190°C.
    • Available in two color versions: Gray (RAL 7038) and Black (RAL 7016).
  • DOWSIL™ Q4-2805 Fluorosilicone Channel Sealant
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    DOWSIL™ Q4-2805 Fluorosilicone Channel Sealant
    • Superior sealing characteristics when exposed to fuels and oils
    • Easily injected and reinjected
    • Does not harden
    • Good grip
    • Essentially unaffected by shock, vibration, and thermal cycling
    • Contains no hardeners or curing agents
    • Withstands immersion in fuels and exposure to fuel vapors at temperatures up to +200°C
    • Contains flow control particles
    • Excellent flow characteristics allow faster injection at lower pressures.
  • DOWSIL™ R41 Cleaner Plus
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    DOWSIL™ R41 Cleaner Plus
    • Cleaning solvent
    • Contains a special catalyst for adhesion preparation
    • Easy to apply
    • Ready to use
    • Cleaning and surface preparation in one step
    • Increased security
  • DOWSIL™ SE 4420
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    DOWSIL™ SE 4420
    • Polymerization at room temperature
    • Good adhesion on various substrates
    • Fast tack-free time
    • Elastomeric material with high elongation
    • Suitable for bonding, sealing and thermal dissipation
    • Good mechanical strength
  • DOWSIL™ Silicone AP Adhesive Sealant
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    DOWSIL™ Silicone AP Adhesive Sealant
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Good adhesion on many substrates
  • DOWSIL™ TC-2035 Thermally Conductive Adhesive
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    DOWSIL™ TC-2035 Thermally Conductive Adhesive
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
  • DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
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    DOWSIL™ TC-4535 CV Thermally Conductive Gap Filler
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
  • EPIBOND® 115 A/B
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    EPIBOND® 115 A/B
    • High-temperature structural epoxy adhesive
    • Two-component epoxy adhesive
    • Service up to 149°C (300°F)
    • High shear strength on metals and composites
    • Thixotropic gap-filling paste
    • Contains 125-micron spacer beads
    • High Tg
  • EPIBOND® 200 A/B
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    EPIBOND® 200 A/B
    • Flexible epoxy structural adhesive
    • High shear and peel strength
    • Gap-filling with thixotropic behavior
    • Polymerization at room temperature
    • Good performance retention after environmental aging
    • 1:1 mixing ratio by weight and volume
    • SVHC-free according to REACH
  • EPIBOND® 215 A/B
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    EPIBOND® 215 A/B
    • High-strength structural epoxy adhesive
    • High shear and peel strength
    • Gap-filling with thixotropic behavior
    • Polymerization at room temperature
    • Fast handling strength
    • Good performance retention after environmental aging and chemical immersion
    • SVHC-free according to REACH
  • EPIBOND® 315 A/B
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    EPIBOND® 315 A/B
    • Two-component epoxy adhesive
    • Pasty consistency
    • High mechanical strength
    • Good adhesion to metals
  • EPIBOND® 420 A/B
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    EPIBOND® 420 A/B
    • Structural applications
    • Room temperature curing paste
    • High toughness and resilience
  • EPIBOND® 8000 FR A/B
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    EPIBOND® 8000 FR A/B
    • Structural epoxy adhesive, flame retardant
    • Self-extinguishing properties according to FAR 25.853
    • High shear and peel strength
    • Thixotropic gap-filling paste
    • Curable from room temperature to elevated temperatures
    • Free of halogenated additives and antimony
    • No SVHC according to REACH
  • EPOCAST® 1614-A3
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    EPOCAST® 1614-A3
    • Syntactic structural epoxy adhesive
    • Single-component supplied frozen
    • Paste consistency after thawing
    • Extrudable with standard equipment
    • Designed for structural applications on honeycomb
  • EPOCAST® 1617 A/B
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    EPOCAST® 1617 A/B
    • Two-component structural epoxy adhesive
    • Low-density syntactic formulation
    • Good mechanical strength-to-density ratio
    • Suitable for structural applications
  • EPOCAST® 1618 D/B
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    EPOCAST® 1618 D/B
    • Low density syntactic epoxy adhesive
    • Flame retardant and self-extinguishing
    • Extrudable but non-sagging after application
    • Fast curing at room temperature
    • Suitable for potting inserts in honeycomb structures