The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing
    • Non-curing
    • High thermal conductivity
    • Low thermal resistance
    • Solvent-free formulation
    • Thixotropic - low flowability
    • Applicable via screen printing, stencil or dispensing
    • Ability to achieve thin thicknesses
    • Not smooth
    • Low levels of volatile condensable materials
    • High elongation for greater stress reduction
    • No mixing required
    • Faster inline machining with optional thermal acceleration
    • Proven for space applications
    • One-component adhesive sealant
    • Cures at room temperature when exposed to air humidity
    • Alkoxyl polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Excellent adhesion to many substrates
    • Stable and flexible from -40°C (-40°F) to 180°C (356°F)
    • Provides instant green force
    • Easy-to-use one-component adhesive sealant
    • Cures at room temperature when exposed to air humidity
    • Excellent adhesion to a wide range of substrates such as glass, metals and plastics
    • Pasty and non-sticky consistency
    • Cures into a durable and flexible rubber
    • Stable and flexible from -50°C to +150°C
    • UL 94 HB
    • Rapid resistance formation promotes increased productivity due to rapid handling of bonded units
    • Saves time because no buffer is needed for increasing resistance
    • One-component adhesive sealant
    • Cures at room temperature when exposed to moisture in the air
    • Alkoxy polymerization system
    • Pasty consistency, does not bag
    • Easy to apply
    • Low modulus for high movement capacity
    • Good adhesion on many substrates
    • Stable and flexible from -50°C (-58°F) to +180°C (+356°F)
    • One-component adhesive sealant
    • Cures at room temperature when exposed to air humidity
    • Alkoxyl polymerization system
    • Fluid and self-leveling
    • Easy to apply
    • Excellent primerless adhesion to many substrates
    • Stable and flexible from -50°C to +180°C
    • Non-corrosive to metals
    • Low odor
    • Primerless adhesion to mixed substrates
    • One-component fluorosilicone sealant adhesive.
    • It cures at room temperature when
    • exposed to moisture in the air
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Good adhesion to many substrates
    • Stable and flexible from -65°C (-85°F) to 260°C (500°F)
    • Retains its properties when exposed to fuels, oils and solvents
    • One-component adhesive sealant
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Good adhesion to many substrates
    • Stable and flexible from -60°C to +180°C (-76°F to +356°F), with short peaks up to +205°C (401°F)
    • Black version: stable and flexible from -60°C to +205°C (-76°F to +401°F), with short peaks up to +230°C (446°F)
    • Excellent dielectric properties
    • One-component adhesive sealant
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Fluid and self-leveling
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Rapid no-grip time
    • Good adhesion to many substrates
    • Stable and flexible from -65°C (-85°F) to +180°C (+356°F)
    • Excellent dielectric properties
    • It does not sag and drip
    • Can be applied overhead or on side walls
    • Can be used in applications with continuous exposure at 260°C (500°F) and intermittent exposure at 315°C (600°F)
    • Not smooth
    • Polymerization at room temperature
    • High elongation for greater stress reduction
    • No mixing required
    • Polymerization at room temperature, no need for ovens
    • Faster inline machining with optional thermal acceleration
    • Improved reliability through reduced curing stresses
    • Automated or manual needle dispensing systems
    • Can be used in corrosion-sensitive electrical equipment and PCB systems without adverse effects
    • Easy to handle
    • UL Classified
    • Non-corrosive
    • Low odor
    • Cures at room temperature
    • Single-component adhesive/sealant
    • Cures at room temperature when exposed to air humidity
    • Acetoxy polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Cures into a durable and flexible rubber
    • Good adhesion on many substrates
    • Stable and flexible from -50°C (-58°F) to 180°C (356°F)
    • 100% silicone
    • Superior adhesion to a wide variety of surfaces
    • Low odor
    • Neutral polymerization (alcohol)
    • Does not corrode metal or other sensitive materials
    • Forms a flexible and long-lasting seal
    • Improves the inhibition resistance of addition-cured silicones
    • Diluted in heptane
    • Most metals, glass and ceramics
    • High viscosity
    • Lump-free
    • High performance
    • Adheres well to primed surfaces
    • Single-component adhesive/sealant
    • Cures at room temperature when exposed to air humidity
    • Alkoxyl polymerization system
    • Pasty and non-sagging consistency
    • Easy to apply
    • Excellent primerless adhesion to many substrates
    • Non-corrosive for metals
    • Stable and flexible from -50°C to +150°C
    • Medium viscosity
    • Abrasion-resistant elastoplastic surface
    • Solvent-based coating
    • High solid content
    • UV indicator for inspection
    • Room temperature vulcanization (RTV)
    • Good adhesion on rigid and flexible PCBs
    • Low viscosity, spray applicable
    • Fast UV cure with secondary moisture cure
    • Solvent-free
    • UV indicator for inspection
    • Good adhesion to PCB materials
    • Reduced oxygen inhibition