Dowsil
Showing 41–60 of 84 results
Filtri
Tipo di prodotto
- 1 Cleaner
- 10 Conformal coating
- 28 Elastomeric adhesive
- 16 Electronics adhesive
- 2 Gap filler
- 6 Gel
- 10 Heat-conductive adhesive
- 5 Primer
- 4 Resins and encapsulants
- 1 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
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- High viscosity
- Lump-free
- High performance
- Adheres well to primed surfaces
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Good tensile strength High adhesive capacity Low thermal conductivity Good resistance to weathering Two-component with room temperature curing Stable even at high temperatures
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- Single-component adhesive/sealant
- Cures at room temperature when exposed to air humidity
- Alkoxyl polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Excellent primerless adhesion to many substrates
- Non-corrosive for metals
- Stable and flexible from -50°C to +150°C
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- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
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- Low ionic impurities
- Very high thermal conductivity
- Loaded silver
- Good adhesion to Ni, Al, laminate and silicon
- Microelectronic grade material
- High electroconductive performance
- Good adhesive performance for TIM1 applications
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- Two-component adhesive sealant
- Rapid polymerization at room temperature
- Neutral alkoxide polymerization
- Pasty, non-self-levelling consistency
- Good and durable adhesion
- Excellent weather, UV and heat resistance up to 190°C
- Rapid curing allows rapid handling of bonded components
- Deep polymerization
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- Two-component adhesive sealant
- Rapid polymerization at room temperature
- Neutral alkoxide polymerization
- Pasty, non-self-levelling consistency
- Good and durable adhesion
- Excellent weather, UV and heat resistance up to 190°C
- Rapid curing allows rapid handling of bonded components
- Deep polymerization
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- Fast and homogeneous deep polymerization
- Early adhesion at room temperature
- Pasty, non-self-levelling consistency
- Rapid handling of bonded components
- Fast assembly process
- Durable adhesion to a wide variety of substrates
- Excellent resistance to weathering and U.V. rays.
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No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
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- Electromagnetic shielding
- Easy to dose and cure at room temperature
- Dow's unique formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance
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- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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- Polymerization at room temperature
- Low viscosity - ease of processing
- Self-adhesive - no primer required
- Reliable optical performance in difficult conditions
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- Meets BS 476 Part 22 standard
- Excellent primerless adhesion on most substrates
- porous and non-porous buildings
- It does not drip
- Joint movement capacity ±50%
- Neutral curing system
- Halogen-free
- Complies with ISO 11600-F&G-25LM Standard
- A fire resistance value of up to 4 hours can be obtained
- Extensively tested on many European specifications
- Out of footprint in 1.5 hours
- Excellent weathering characteristics, including resistance to ozone, UV radiation and extreme temperatures
- Long service life
- CE marked as fire resistant according to ETAG 026
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- One-component clear primer
- Dispersed in naphtha
- Improves adhesion of RTV and thermosetting silicones to many substrates
- Can be used on most substrates
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- Improves the adhesion of RTV and thermosetting silicones
- Improves the adhesion of many wet-cure RTV silicones
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- Improves the adhesion of RTV and thermoset silicones to substrates
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- Cures at room temperature when exposed to air humidity
- Acetoxy polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Good adhesion on many substrates
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- Rapid handling of bonded components: rapidly develops adhesive strength at room temperature, enabling rapid handling of components.
- Adheres to suitably prepared polypropylene.
- Two-component system with 10:1 mixture ratio by weight. Non-corrosive and low-odor curing.
- It contains no solvents.
- The non-lumpy nature of the mixture allows the extruded bead to remain in place without flowing.
- Excellent resistance to weathering, UV rays and heat up to 190°C.
- Available in two color versions: Gray (RAL 7038) and Black (RAL 7016).
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- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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- Superior sealing characteristics when exposed to fuels and oils
- Easily injected and reinjected
- Does not harden
- Good grip
- Essentially unaffected by shock, vibration, and thermal cycling
- Contains no hardeners or curing agents
- Withstands immersion in fuels and exposure to fuel vapors at temperatures up to +200°C
- Contains flow control particles
- Excellent flow characteristics allow faster injection at lower pressures.
