DOWSIL™ 3-6753 Thermally Conductive Adhesive

  • Mixing ratio: 1 to 1
  • Highly fluent
  • Self-leveling
  • Versatile thermal polymerization
  • Ensures heat flow away from components
  • With 7 mil glass microspheres
  • Check the thickness of the adhesion line
  • Without added solvents

Additional information

Product Type
Brand
Technology
Base
Dielectric strength (kV/mm)
Viscosity
Color
Polimerizzazione
Range termico operativo
Thermal conductivity
Applications ,