Silicon

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Tipo di prodotto

Marchio

Tecnologia

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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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DOWSIL™ 340 Heat Sink Compound
- Not smooth
- Moderate thermal conductivity
- Does not require ovens or curing
- Heat flow away from circuit components can increase reliability
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DOWSIL™ 4535
- No exotherm during curing
- Room temperature or heat-accelerated polymerization
- High stability during thermal cycles up to 150°C (peak 175°C)
- Maintains vertical position
- Controlled low silicone volatility
- Soft and elastomeric material after polymerization
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DOWSIL™ 5351
- Non-curing
- High thermal conductivity
- Stable on vertical surfaces
- Gap filling capacity up to 1.0 mm
- Thermally conductive silicone material
- Low thermal resistance and good high-temperature stability
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DOWSIL™ 5515
- Low density
- Room temperature or heat-accelerated polymerization
- Non-sagging, stable even on vertical surfaces
- Soft and deformable material with stress relief function
- Slightly tacky surface after curing
- No exotherm during curing
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DOWSIL™ 5888
- Non-curing
- High thermal conductivity
- Low thermal resistance
- Solvent-free formulation
- Thixotropic - low flowability
- Applicable via screen printing, stencil or dispensing
- Ability to achieve thin thicknesses
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DOWSIL™ EA-9189 H White RTV Adhesive

No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
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DOWSIL™ SC 102 Compound
- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
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DOWSIL™ SE 4420
- Polymerization at room temperature
- Good adhesion on various substrates
- Fast tack-free time
- Elastomeric material with high elongation
- Suitable for bonding, sealing and thermal dissipation
- Good mechanical strength
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
- One-component adhesive
- Thermally conductive
- Polymerizes with moisture
- Fast drying to the touch
- Good adhesion
- Self-leveling
- Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 9184 RTV Adhesive
- Rapid polymerization in RT, without notches
- Not smooth
- Higher thermal conductivity
- Controlled volatility of silicone
- No mixing required
- Polymerization at room temperature
- Faster processing at room temperature
- Used if increased flame resistance is required
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DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
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DOWSIL™ TC-4515 Gap Filler A&B
- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
- Polymerization at room temperature
- Long-term performance stability up to 150°C
- Low compression stress
- Maintains upright position (cured or uncured state)
- Controlled volatility of silicone
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DOWSIL™ TC-5026 Thermally Conductive Compound
- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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DOWSIL™ TC-5080 Thermally Conductive Compound
- Good thermal conductivity
- Low oil bleed
- Stable at high temperatures
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DOWSIL™ TC-5121C LV Thermally Conductive Compound
- Polymer matrix helps reduce pump out
- Fluid
- Good thermal conductivity
- Low thermal resistance
- Does not polymerize
- Heat removal from PCB system components
- Possible to obtain bond line thickness (BLT).
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DOWSIL™ TC-5622 Thermally Conductive Compound
- Solvent-free formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability
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Electrolube HTS Silicone Heat Transfer Compound
- General purpose thermal management paste
- Excellent stability under a wide range of conditions
- Silicone oil-based
- Wide operating temperature range
- Good thermal conductivity
- Use as a thermal interface material
- Non-curing paste
- Allows rework of components
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Electrolube HTSP Silicone Heat Transfer Compound Plus
- Thermal conductivity at elevated temperatures
- Very low oil separation
- Excellent anti-creep characteristics
- Wide range of operating temperatures
- Low evaporation weight loss
- Optimal heat dissipation efficiency
- Also facilitates application by screen printing
- Non-hardening paste
- Allows for easy rework