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Silicon (16)
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
Mixing ratio: 1 to 1
Highly fluent
Self-leveling
Versatile thermal polymerization
Ensures heat flow away from components
With 7 mil glass microspheres
Check the thickness of the adhesion line
Without added solvents
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DOWSIL™ 340 Heat Sink Compound
Not smooth
Moderate thermal conductivity
Does not require ovens or curing
Heat flow away from circuit components can increase reliability
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DOWSIL™ EA-9189 H White RTV Adhesive
No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
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DOWSIL™ SC 102 Compound
Moderate thermal conductivity
One part: no ovens or curing required
Pulls heat away from critical components
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
One-component adhesive
Thermally conductive
Polymerizes with moisture
Fast drying to the touch
Good adhesion
Self-leveling
Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 9184 RTV Adhesive
Rapid polymerization in RT, without notches
Not smooth
Higher thermal conductivity
Controlled volatility of silicone
No mixing required
Polymerization at room temperature
Faster processing at room temperature
Used if increased flame resistance is required
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DOWSIL™ TC-4025 Dispensable Thermal Pad
Can be used as a printable PAD
Can replace the traditional manufactured pad
Use as a gap filler
Dispensed or printed through manual or automated processes
Deposit of features for precise coverage of components
Lower cost of ownership than manufactured pads
Excellent thermal performance
Soft, stress-relieving and shock-dampening
Reworkable
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DOWSIL™ TC-4515 Gap Filler A&B
Mixing ratio mixture 1:1
Thermally conductive silicone
Platinum curing system
Polymerization at room temperature
Provides long-term stability
Polymerizes without exothermia
Thixotropic, non-sagging
Resistant to ozone and ultraviolet degradation
Provides high cooling performance
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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
Polymerization at room temperature
Long-term performance stability up to 150°C
Low compression stress
Maintains upright position (cured or uncured state)
Controlled volatility of silicone
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DOWSIL™ TC-5026 Thermally Conductive Compound
Solvent-free formulation
Sliding
Does not polymerize
Able to achieve bond line thickness
Very low thermal resistance
High thermal conductivity
Wicks heat away from sensitive components
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DOWSIL™ TC-5080 Thermally Conductive Compound
Good thermal conductivity
Low oil bleed
Stable at high temperatures
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DOWSIL™ TC-5121C LV Thermally Conductive Compound
Polymer matrix helps reduce pump out
Fluid
Good thermal conductivity
Low thermal resistance
Does not polymerize
Heat removal from PCB system components
Possible to obtain bond line thickness (BLT).
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DOWSIL™ TC-5622 Thermally Conductive Compound
Solvent-free formulation
Easy application
Low thermal resistance
High thermal conductivity
Good stability and reliability
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Electrolube HTS Silicone Heat Transfer Compound
General purpose thermal management paste
Excellent stability under a wide range of conditions
Silicone oil-based
Wide operating temperature range
Good thermal conductivity
Use as a thermal interface material
Non-curing paste
Allows rework of components
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Electrolube HTSP Silicone Heat Transfer Compound Plus
Thermal conductivity at elevated temperatures
Very low oil separation
Excellent anti-creep characteristics
Wide range of operating temperatures
Low evaporation weight loss
Optimal heat dissipation efficiency
Also facilitates application by screen printing
Non-hardening paste
Allows for easy rework
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Electrolube RTV Thermally Conductive Oxime
Increased adhesion strength
Can be used as a sealant or thermal adhesive
High thermal conductivity
Combines adhesive and heat dissipation properties
Very wide operating temperature range
Single-component
Not lumpy
Ideal if high viscosity product required
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