Additional information
| Product Type | Gel |
|---|---|
| Brand | Dowsil |
| Technology | Silicone |
| Viscosity | <1,000 mPa.s |
| Color | Transparent |
| Polymerization | Hot |
| Gel time | >120 min |
| Hardness | Soft |
| Thermal operating range | >150°C |
| Applications | Potting, Printed circuit board PCB |
DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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