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Elastomeric adhesive (2)
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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.
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Advantra® BOLD 9480
High thermal stability
Quick grip
Effective on difficult surfaces
Good internal cohesion
Excellent frost resistance
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Advantra® Earthic™ 9370
Heat and cold resistant
Effective adhesion on standard and critical surfaces
High thermal stability
Formulated with 63% fossil-free material
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BAMFutura® 43
Versatile formulation
Adhesion on different substrates
Excellent thermal stability
Flexible to extreme temperatures
Also available in vegan version
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BAMFutura® 43C
Highly versatile metallocene-based adhesive
Good flexibility even at low temperatures
Anti-agglomerating properties
Good thermal resistance
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BAMFutura® 44LV
High heat resistance
Quick grip
Clean cut from the nozzle
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BAMFutura® 46
Applicable at low temperatures
High thermal stability
Excellent processability on fast lines
Clean and precise adhesion
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BAMFutura® 51
Low odor formulation
Good flexibility at low temperatures
Resistant to mint oil
Stable adhesion on difficult materials
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BAMFuture 1
High adhesion on multiple substrates
Low emissions and high thermal stability
Ideal for high production speeds
Withstands hot storage conditions
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Condat Millenium
Excellent behavior in the presence of water
Naturally resistant to impact and heavy loads
Very high drop point
Corrosion protection even in saline environments
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Condat Millenium 505
A next-generation ultra-high-tech grease
Designed for general lubrication of most mechanical parts under exceptional conditions
Can be used with very long intervals between refills in all areas
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Condat Millenium 505/1
Outstanding mechanical stability in the presence of water or emulsion, compared with conventional fats
Excellent water resistance
Very high drop point
Excellent AW and EP performance
Withstands shocks and very heavy loads without breaking
High natural protection against rust and corrosion
Very high resistance to oxidation
Ease of pumping in centralized greasing systems
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DOWSIL™ 3810 EG
One-part dielectric gel
Transparent
Hot polymerization
Low viscosity
Very soft gel
Suitable for PCB potting and electronic component protection
Electrical insulation and environmental protection
Extended temperature range (-60°C / +200°C)
No mixing required
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DOWSIL™ 4535
No exotherm during curing
Room temperature or heat-accelerated polymerization
High stability during thermal cycles up to 150°C (peak 175°C)
Maintains vertical position
Controlled low silicone volatility
Soft and elastomeric material after polymerization
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DOWSIL™ 5351
Non-curing
High thermal conductivity
Stable on vertical surfaces
Gap filling capacity up to 1.0 mm
Thermally conductive silicone material
Low thermal resistance and good high-temperature stability
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DOWSIL™ 5515
Low density
Room temperature or heat-accelerated polymerization
Non-sagging, stable even on vertical surfaces
Soft and deformable material with stress relief function
Slightly tacky surface after curing
No exotherm during curing
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DOWSIL™ 5888
Non-curing
High thermal conductivity
Low thermal resistance
Solvent-free formulation
Thixotropic - low flowability
Applicable via screen printing, stencil or dispensing
Ability to achieve thin thicknesses
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DOWSIL™ CC 2588
Medium viscosity
Abrasion-resistant elastoplastic surface
Solvent-based coating
High solid content
UV indicator for inspection
Room temperature vulcanization (RTV)
Good adhesion on rigid and flexible PCBs
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DOWSIL™ CC 8030 UV
Low viscosity, spray applicable
Fast UV cure with secondary moisture cure
Solvent-free
UV indicator for inspection
Good adhesion to PCB materials
Reduced oxygen inhibition
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DOWSIL™ EC-8425
High electrical conductivity (silver-based filler)
Electromagnetic shielding (EMC) over a wide frequency range
High elongation for stress relief (>20%)
Non-slump adhesive (non-flowable)
UV traceability for inspection
Good adhesion on various substrates
Solvent-free formulation
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DOWSIL™ SE 4420
Polymerization at room temperature
Good adhesion on various substrates
Fast tack-free time
Elastomeric material with high elongation
Suitable for bonding, sealing and thermal dissipation
Good mechanical strength
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