+180°C

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • High thermal stability
    • Quick grip
    • Effective on difficult surfaces
    • Good internal cohesion
    • Excellent frost resistance
    • Heat and cold resistant
    • Effective adhesion on standard and critical surfaces
    • High thermal stability
    • Formulated with 63% fossil-free material
    • Versatile formulation
    • Adhesion on different substrates
    • Excellent thermal stability
    • Flexible to extreme temperatures
    • Also available in vegan version
    • Highly versatile metallocene-based adhesive
    • Good flexibility even at low temperatures
    • Anti-agglomerating properties
    • Good thermal resistance
     
    • High heat resistance
    • Quick grip
    • Clean cut from the nozzle
    • Applicable at low temperatures
    • High thermal stability
    • Excellent processability on fast lines
    • Clean and precise adhesion
    • Low odor formulation
    • Good flexibility at low temperatures
    • Resistant to mint oil
    • Stable adhesion on difficult materials
    • High adhesion on multiple substrates
    • Low emissions and high thermal stability
    • Ideal for high production speeds
    • Withstands hot storage conditions
    • Excellent behavior in the presence of water
    • Naturally resistant to impact and heavy loads
    • Very high drop point
    • Corrosion protection even in saline environments
    • A next-generation ultra-high-tech grease
    • Designed for general lubrication of most mechanical parts under exceptional conditions
    • Can be used with very long intervals between refills in all areas
    • Outstanding mechanical stability in the presence of water or emulsion, compared with conventional fats
    • Excellent water resistance
    • Very high drop point
    • Excellent AW and EP performance
    • Withstands shocks and very heavy loads without breaking
    • High natural protection against rust and corrosion
    • Very high resistance to oxidation
    • Ease of pumping in centralized greasing systems
    • One-part dielectric gel
    • Transparent
    • Hot polymerization
    • Low viscosity
    • Very soft gel
    • Suitable for PCB potting and electronic component protection
    • Electrical insulation and environmental protection
    • Extended temperature range (-60°C / +200°C)
    • No mixing required
    • No exotherm during curing
    • Room temperature or heat-accelerated polymerization
    • High stability during thermal cycles up to 150°C (peak 175°C)
    • Maintains vertical position
    • Controlled low silicone volatility
    • Soft and elastomeric material after polymerization
    • Non-curing
    • High thermal conductivity
    • Stable on vertical surfaces
    • Gap filling capacity up to 1.0 mm
    • Thermally conductive silicone material
    • Low thermal resistance and good high-temperature stability
    • Low density
    • Room temperature or heat-accelerated polymerization
    • Non-sagging, stable even on vertical surfaces
    • Soft and deformable material with stress relief function
    • Slightly tacky surface after curing
    • No exotherm during curing
    • Non-curing
    • High thermal conductivity
    • Low thermal resistance
    • Solvent-free formulation
    • Thixotropic - low flowability
    • Applicable via screen printing, stencil or dispensing
    • Ability to achieve thin thicknesses
    • Medium viscosity
    • Abrasion-resistant elastoplastic surface
    • Solvent-based coating
    • High solid content
    • UV indicator for inspection
    • Room temperature vulcanization (RTV)
    • Good adhesion on rigid and flexible PCBs
    • Low viscosity, spray applicable
    • Fast UV cure with secondary moisture cure
    • Solvent-free
    • UV indicator for inspection
    • Good adhesion to PCB materials
    • Reduced oxygen inhibition
    • High electrical conductivity (silver-based filler)
    • Electromagnetic shielding (EMC) over a wide frequency range
    • High elongation for stress relief (>20%)
    • Non-slump adhesive (non-flowable)
    • UV traceability for inspection
    • Good adhesion on various substrates
    • Solvent-free formulation
    • Polymerization at room temperature
    • Good adhesion on various substrates
    • Fast tack-free time
    • Elastomeric material with high elongation
    • Suitable for bonding, sealing and thermal dissipation
    • Good mechanical strength