The new two-component silicone gel DOWSIL™ EG-4000

Industry trends require smaller and smaller components with higher and higher powers. This trend requires the presence of better performing gels that protect assemblies and their properties. DOWSIL ™ EG-4000 high temperature dielectric gels are silicone dielectric gels suitable for PCBs and power modules, are designed to protect interconnections from environmental conditions and to provide dielectric isolation.

DOWSIL ™ EG-4000 is a very soft gel also suitable for thin-layer applications that finds its perfect application when stress from thermal cycling, shock and vibration on components needs to be minimized.

This gel is a silicone, dielectric, two-component, heat-curing material that offers exceptional thermal stability over a wide temperature range up to 200°C in continuous mode (validated by accelerated aging at 215°C for 3000 hours according to UL- 1557 standard). The chemistry is also designed to expand the temperature resistance at the lower limit to -60°C to meet specific market needs.

These properties enable DOWSIL ™ EG-4000 gel to provide long-lasting performance as a protective filler material for power conversion applications, such as insulated gate bipolar transistor (IGBT) modules used in power electronics.

Its unique combination of thermal stability and extremely low modulus also makes it an attractive solution for automotive PCB system assemblies, sensors, and actuators that must operate reliably over wide temperature ranges and when highly stress-sensitive components are present.

The new Dowsil Gels provide:

• Protection for interconnections subject to thermal and mechanical stresses
• Stability in harsh environmental conditions
• No surface cracking or delamination of the housing over a wide temperature range