DOWSIL™ 5351

DOWSIL™ 5351

  • Non-curing
  • High thermal conductivity
  • Stable on vertical surfaces
  • Gap filling capacity up to 1.0 mm
  • Thermally conductive silicone material
  • Low thermal resistance and good high-temperature stability
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Additional information

Product Type
Brand
Technology
Dielectric strength (kV/mm)
Viscosity
Color
Thermal conductivity
Applications , ,
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