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Showing 1–20 of 42 results

Tipo di prodotto

11 Conformal coating Conformal coating
3 Electronics adhesive Electronics adhesive
2 Gap filler Gap filler
2 Heat-conductive adhesive Heat-conductive adhesive
21 Resins and encapsulants Resins and encapsulants
1 Thermal conductive paste Thermal conductive paste

Marchio

Tecnologia

Applicazioni

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Araldite® CW 2243-1L
- Low viscosity
- Flexible jets
- Good resistance to thermal shock
- Semi-rigid system
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Araldite® CW 2245
- Good resistance to temperature shock
- Flexible jets
- Low viscosity
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Araldite® XB 2252-1 / XB 2253-1
- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
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Arathane® CW 5620
- Good thermal resistance
- Excellent sliding properties
- Good thermal conductivity
- Non-abrasive casting system
- Good resistance to thermal shock
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Arathane® CW 5620 / Arathane® HY 5610
- Two-component resin for high temperature
- It cross-links at room temperature but can be accelerated with heat
- Halogen-free system
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Arathane® Vb U 6912 P Polyol / Vb U001/B Isocian
- Polymerization at room temperature or moderate heat
- Easy castability and impregnation
- Mixing ratio 100:23 by weight
- Excellent electrical properties
- Absorbs sudden thermal shock
- Suitable for a low-stress encapsulant
- Halogen free
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DOWSIL™ 1-2577 Conformal Coating
- Cures to an elastoplastic surface
- Resilient and abrasion resistant
- Single-component solvent-based resin coating
- Polymerization at room temperature
- It can speed up in-line processing
- UV indicator enables automatic inspection
- Allows use with many low-solids lead-free solder
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DOWSIL™ 1-2577 Low VOC Conformal Coating
- Cures to an elastoplastic surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- The optional thermal acceleration (after solvent wilting)
- UV indicator enables automated inspection
- Allows use with many low-solids lead-free solder
- Reduced VOC content
- Emission recovery can be simplified for VOCs in some U.S. states
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
- Cures to a robust surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- Possibility of acceleration after solvent spillage
- UV indicator for inspection
- Allows use with many low-solids lead-free solder
- Low viscosity improves flow and
- fill tight spaces and gaps
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DOWSIL™ 1-2620 Low VOC Conformal Coating
- Medium viscosity
- Low VOC content
- Abrasion resistance
- Good dielectric properties
- Good adhesion to many substrates
- Polymerization at room temperature
- Stable and flexible over a wide temperature range
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
- Fluid
- Hot polymerization
- Good thermal conductivity values
- No solvent added
- Single-component - No need to mix separate components
- Fast and versatile polymerization controlled by temperature
- Fills and self-levels after dispensing
- Heat dissipation from PCB systems to increase reliability
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DOWSIL™ 3-1944 RTV Coating
- Single-component, does not require mixing
- Good fluidity
- After dispensing, it is capable of flowing, filling or self-leveling
- Faster inline machining with optional thermal acceleration
- No solvent added
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
- UV indicator enables automatic inspection
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DOWSIL™ 3-1953 Conformal Coating
- No solvent added
- Polymerization at room temperature
- Slight thermal acceleration can speed up in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
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DOWSIL™ 3-1965 Conformal Coating
- No solvent added
- Polymerization at room temperature
- It can speed up in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Improves reliability against stresses
- Promotes flow and filling of narrow spaces and crevices
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DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
- Mellow
- Polymerization in rapid RTV
- Good "green" resistance
- Single-component - No mixing required
- Polymerization at room temperature
- Fast skin time
- High self-extinguishing
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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DOWSIL™ SE 9184 RTV Adhesive
- Rapid polymerization in RT, without notches
- Not smooth
- Higher thermal conductivity
- Controlled volatility of silicone
- No mixing required
- Polymerization at room temperature
- Faster processing at room temperature
- Used if increased flame resistance is required
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DOWSIL™ SE 9188 RTV Adhesive
- Mellow
- Controlled volatility of silicone
- Single-component - No mixing required
- Polymerization at room temperature
- Self-extinguishing UL94 V-0
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DOWSIL™ SE 9189 L RTV
- Rapid polymerization
- Sliding
- Polymerizes into a soft, low-stress elastomer
- Controlled volatility of silicone
- No solvent added
- Polymerization at room temperature
- Faster processing at room temperature with thermal acceleration
- Soft coating can improve reliability against stresses
- Can be used if flame resistance required