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UL94 self-extinguishing
V-0
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Araldite® CW 2243-1L
Low viscosity
Flexible jets
Good resistance to thermal shock
Semi-rigid system
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Araldite® CW 2245
Good resistance to temperature shock
Flexible jets
Low viscosity
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Araldite® XB 2252-1 / XB 2253-1
Good resistance to thermal shock
Good dielectric properties
Good mechanical properties
Excellent thermal resistance
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Arathane® CW 5620
Good thermal resistance
Excellent sliding properties
Good thermal conductivity
Non-abrasive casting system
Good resistance to thermal shock
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Arathane® CW 5620 / Arathane® HY 5610
Two-component resin for high temperature
It cross-links at room temperature but can be accelerated with heat
Halogen-free system
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Arathane® Vb U 6912 P Polyol / Vb U001/B Isocian
Polymerization at room temperature or moderate heat
Easy castability and impregnation
Mixing ratio 100:23 by weight
Excellent electrical properties
Absorbs sudden thermal shock
Suitable for a low-stress encapsulant
Halogen free
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DOWSIL™ 1-2577 Conformal Coating
Cures to an elastoplastic surface
Resilient and abrasion resistant
Single-component solvent-based resin coating
Polymerization at room temperature
It can speed up in-line processing
UV indicator enables automatic inspection
Allows use with many low-solids lead-free solder
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DOWSIL™ 1-2577 Low VOC Conformal Coating
Cures to an elastoplastic surface
Resilient and abrasion resistant
Solvent-based resin coating
Polymerization at room temperature
The optional thermal acceleration (after solvent wilting)
UV indicator enables automated inspection
Allows use with many low-solids lead-free solder
Reduced VOC content
Emission recovery can be simplified for VOCs in some U.S. states
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
Cures to a robust surface
Resilient and abrasion resistant
Solvent-based resin coating
Polymerization at room temperature
Possibility of acceleration after solvent spillage
UV indicator for inspection
Allows use with many low-solids lead-free solder
Low viscosity improves flow and
fill tight spaces and gaps
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DOWSIL™ 1-2620 Low VOC Conformal Coating
Medium viscosity
Low VOC content
Abrasion resistance
Good dielectric properties
Good adhesion to many substrates
Polymerization at room temperature
Stable and flexible over a wide temperature range
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
Fluid
Hot polymerization
Good thermal conductivity values
No solvent added
Single-component - No need to mix separate components
Fast and versatile polymerization controlled by temperature
Fills and self-levels after dispensing
Heat dissipation from PCB systems to increase reliability
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DOWSIL™ 3-1944 RTV Coating
Single-component, does not require mixing
Good fluidity
After dispensing, it is capable of flowing, filling or self-leveling
Faster inline machining with optional thermal acceleration
No solvent added
Allows use with many low-solids lead-free solder
Soft coating improves reliability against stresses
UV indicator enables automatic inspection
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DOWSIL™ 3-1953 Conformal Coating
No solvent added
Polymerization at room temperature
Slight thermal acceleration can speed up in-line processing
Good adhesion to many substrates
Allows use with many low-solids lead-free solder
Soft coating improves reliability against stresses
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DOWSIL™ 3-1965 Conformal Coating
No solvent added
Polymerization at room temperature
It can speed up in-line processing
Good adhesion to many substrates
Allows use with many low-solids lead-free solder
Improves reliability against stresses
Promotes flow and filling of narrow spaces and crevices
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DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
Mellow
Polymerization in rapid RTV
Good "green" resistance
Single-component - No mixing required
Polymerization at room temperature
Fast skin time
High self-extinguishing
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
Low viscosity
Good thermal conductivity
Mixing ratio 1 to 1
Polymerization at room temperature
Easy to mix and use
Good smoothness for fast processing and short cycle times
Promotes heat dissipation
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Reduces pressure on components
Effectively dissipates heat
Avoids delamination problems
The rapid polymerization
Optimized processing time
Allows for the implementation of complex projects
No additional dielectric barrier required
Allows for quick filling
It is suitable for high-throughput production processes.
Filling allows easy control of the process
Meets certification requirements
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DOWSIL™ SE 9184 RTV Adhesive
Rapid polymerization in RT, without notches
Not smooth
Higher thermal conductivity
Controlled volatility of silicone
No mixing required
Polymerization at room temperature
Faster processing at room temperature
Used if increased flame resistance is required
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DOWSIL™ SE 9188 RTV Adhesive
Mellow
Controlled volatility of silicone
Single-component - No mixing required
Polymerization at room temperature
Self-extinguishing UL94 V-0
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DOWSIL™ SE 9189 L RTV
Rapid polymerization
Sliding
Polymerizes into a soft, low-stress elastomer
Controlled volatility of silicone
No solvent added
Polymerization at room temperature
Faster processing at room temperature with thermal acceleration
Soft coating can improve reliability against stresses
Can be used if flame resistance required
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