DOWSIL™ 1-4173 Thermally Conductive Adhesive

  • Fluid
  • Hot polymerization
  • Good thermal conductivity values
  • No solvent added
  • Single-component – No need to mix separate components
  • Fast and versatile polymerization controlled by temperature
  • Fills and self-levels after dispensing
  • Heat dissipation from PCB systems to increase reliability

Additional information

Product Type
Brand
Technology
Base
Viscosity
Color
Shore A hardness
UL94 self-extinguishing
Certifications
Applications , , , ,
Number of components