Adesivi hot melt per packaging ed etichettatura
Mascherpa at Focus on PCB 2026: Silicones and Low Pressure Molding for PCBs DowsilElectronicsThermally conductive materialsTrade Shows 2026

Mascherpa at Focus on PCB 2026: Silicones and Low Pressure Molding for PCBs

Key points of the article Mascherpa will be present at Focus on PCB 2026 on May 13-14 in Vicenza, the leading event for the printed circuit board industry. We will present advanced solutions for electronic protection with a focus on silicones and Low Pressure Molding, a new technology that enables…
Mascherpa
April 24, 2026
Fiera Jec Mascherpa 2026
Mascherpa at JEC World 2026: the best of the show AralditeComposite materialsDiatexSaertexTrade Shows 2026

Mascherpa at JEC World 2026: the best of the show

Key Points Mascherpa participated in JEC World 2026, the leading international trade show dedicated to composite materials, presenting industrial solutions and applications. The focus was on Huntsman Araldite® epoxy resin systems for composites, designed to ensure mechanical performance and compatibility with the main production processes. During the show we met…
Mascherpa
March 17, 2026
Mascherpa at JEC World 2026: composite materials and processes 3D CoreAralditeCompositesDiatexFairsHuntsmanJEC WorldSaertexTrade Shows 2026

Mascherpa at JEC World 2026: composite materials and processes

Key Points Mascherpa will be present at JEC World 2026 as an exhibitor together with the European partners of the DGE group. The fair will take place from March 10-12, 2026 at Paris Nord Villepinte, the main global event dedicated to composite materials. At the DGE-Mascherpa booth (Hall 6-Stand G74),…
Mascherpa
February 5, 2026