Key points of the article
- At Focus on PCB 2026, Mascherpa presented the Low Pressure Molding system developed with SIPOL and TECNO INCOLLAGGI.
- At the show, it was possible to see the Tecnostar Overmolding system applied to electronic encapsulation of PCBs.
- Among the solutions on display were also silicones for electronics to improve PCB reliability and thermal management.
- Enrico Quagliato, in his dedicated speech, explored the role of silicones in electronic design.
- Also present at the booth were Cabiotec solutions for quality control and PCB inspection.
Once again this year, we at Mascherpa participated in Focus on PCB 2026, the international trade show dedicated to the entire PCB printed circuit board production chain.
Two days of meetings, technical discussions, and real-world applications, during which our team had the opportunity to engage with professionals from the electronics sector and present solutions dedicated to the protection, encapsulation, and reliability of electronic devices.
Index
- Low Pressure Molding and Electronic Encapsulation
- Hot Melt Materials and Process Control
- Silicones for Electronics and PCB Protection
- Enrico Quagliato’s Speech
- Together with Cabiotec
- The Best of Mascherpa at Focus on PCB 2026
- Thank you to those who visited us
- Learn More About Low Pressure Molding and Silicones for Electronics
Low Pressure Molding and Electronic Encapsulation
One of the key topics presented at the booth Mascherpa was the Low Pressure Molding, the result of the partnership with SIPOL e TECNO INCOLLAGGI forelectronic encapsulation of PCB and sensitive components.
During the show, it was possible to see the Tecnostar Overmolding system applied to the molding process at low pressure and explore the technology’s operation directly during the operational phase.
The process allows electronic components to be protected using single-component thermoplastic adhesives that are melted, injected into the mold, and solidified directly on the component, without damaging sensitive parts.
Hot Melt Materials and Process Control
Alongside the Tecnostar system, the e-TECHNIPOL® materials developed by SIPOL for electronic encapsulation applications were explained.
These materials, available in formulations based on polyamide and polyester, ensure:
- protection from water, dust, and vibrations;
- resistance to low and high temperatures;
- chemical resistance to oils, solvents, and cleaning agents;
- insulating properties for electronic components;
- high mechanical properties, particularly flexibility at low and high temperatures.
During the show, the topic of process control was also explored through the Tecnostar Overmolding system, which integrates:
- high-precision volumetric gear pump;
- parameter control via PLC;
- automatic injector;
- melter with integrated pressure plate.
A configuration designed to ensure:
- accurate control of injection and dwell times;
- stability of the material during the process;
- consistent quality of the finished product
- reduction of production waste and energy consumption.
Silicones for Electronics and PCB Protection
Alongside the topic of electronic encapsulation, during Focus on PCB 2026, Mascherpa also explored the role of silicone materials in the protection and design of PCBs.
The silicones for electronics are used to improve:
- thermal stability;
- management of mechanical stress;
- reliability in thermal cycles;
- resistance to environmental agents.
During the show, it was illustrated how the choice of material can directly influence adhesion, management of thermal expansion, and the reliability of the electronic system over time.
Thanks to the partnership with DOWSIL™, Mascherpa offers advanced silicone solutions dedicated to electronic protection and thermal management of electronic devices.
Enrico Quagliato’s Speech
During Focus on PCB 2026, our expert Enrico Quagliato delivered a speech dedicated to the role of silicones in electronic design.
The presentation explored:
- differences between silicone materials and traditional organic materials;
- management of thermal cycles, stress, and expansion;
- impact of the material on reliability and failure mode;
- behavior at interfaces and adhesion;
- available silicone technologies such as coatings, potting, gels, TIMs, and adhesives.
A technical session dedicated to understanding how material selection can directly influence performance, durability, and operational continuity of electronic devices.
Together with Cabiotec
Also present at our booth was Cabiotec with solutions dedicated to:
- automated optical inspection (AOI);
- X-ray analysis;
- digital microscopy;
- PCB cleaning.
A valuable opportunity to explore the topic of electronic protection also from the perspective of quality control and PCB analysis.
The Best of Mascherpa at Focus on PCB 2026
Our participation in Focus on PCB 2026 was characterized by direct discussions with electronic designers, R&D managers, process engineers, and companies engaged in the development and assembly of electronic devices.
We explored real-world applications, production challenges, and solutions dedicated to electronic protection, demonstrating the Low Pressure Molding process live and the role of silicone materials in the most critical electronic applications.
Thank you to those who visited us
We thank everyone who stopped by to visit us during Focus on PCB 2026.
Direct interaction with companies and industry professionals represents a valuable opportunity for us to explore application requirements, production challenges, and new challenges related to PCB electronic protection.
Learn More About Low Pressure Molding and Silicones for Electronics
If you were unable to attend the show or would like to explore the topics presented at the booth in greater detail, our technical resources dedicated to Low Pressure Molding and silicones for electronics are available.. If you have application questions, contact one of our Mascherpa experts directly.
