The new DOWSIL™ TC-2035 CV adhesive is a high thermal conductivity adhesive that cures rapidly at low temperature and provides excellent stability at room temperature for automotive electronic assembly applications. This innovative technology is helping to power the next generation of low-carbon mobility.
Product Introduction
The new high-performance heat-conductive adhesive offers a combination of outstanding properties: a high thermal conductivity of 3.3 W/m.K for more efficient heat transfer, a low bond line thickness of ~50% for minimal impact on component size, a high elongation at break of ~50% for flexibility and resilience, and easier dispensing that allows convenient application.
DOWSIL™ TC-2035 CV, moreover, offers fast bonding by curing at 115°C/15 minutes, primerless adhesion (on selected substrates) to simplify assembly, a long shelf life of 12 years at or below 35°C for extended storage, and a low volatile content of <100 ppm, which ensures environmental safety.
In particular, DOWSIL TC-2035 excels in several automotive applications, including:
- ADAS (Advanced Driver Assistance Systems).
- Assembly of control units
- Power Electronics
- Converters/inverters
- OBC
Comparison of DOWSIL™ TC-2035 CV and DOWSIL™ TC-2035
Properties | DOWSIL™
CV Adhesive TC-2035 |
DOWSIL™
TC-2035 Adhesive |
Benefits |
Color | Reddish brown | Reddish brown | |
Thermal Conductivity (W/mK) | 3,3 | 3,0 | High thermal conductivity |
Specific gravity – cured | 3,00 | 03,07 | |
Initial extrusion speed (rpm) | Part A: 33
Part B: 52 |
Part A: 43
Part B: 58 |
High dosing speed – higher productivity |
Shelf life (months) | 12 | 6 | Lower scraps |
Storage conditions | ≤ 35°C | ≤ 25°C | Lower scrap and energy consumption |
Pot life (now) | 3,5 | 5 | Simpler processing |
Durometer (Shore D) | 33 | 38 | |
Tensile Strength (MPa) | 37 | 38 | Increased reliability |
Elongation (%) | 50 | 55 | Flexible joints, less material needed |
Adhesion failure mode (%) | ≥90% Cohesive
*Al – A5052P, anodized |
≥90% Cohesive
*Al – A1050P |
Good adhesion without primer |
Shear Adhesion of Foil (MPa) | 2.9; *Al – A5052P, anodized | 2.6; *Al – A1050P | Stronger adhesion |
Polymerization status | 15 minutes at 115°C | 30 minutes at 125°C | Faster processing less energy consumption |
DOWSIL™ adhesive TC-2035 CV
Table 1:
Test | Properties |
CTM1 0176 B | Two parts |
CTM1 0176 B | Color: Part A – WhitePart B – Reddish brown |
CTM 0022 B | Density: Part A and Part B – 3.0g/cm3 |
Mixing ratio – 1:1 | |
Cure time at 115°C – 15 minutes |
Table 2:
Test | Properties | Result |
CTM 1094 C | Viscosity at 1 (1/s)
Part A Part B |
350 Pa.s
290 Pa.s |
CTM 1094 N | Viscosity at 1 (1/s) mixed | 345 Pa.s |
CTM 1393 | Minimum thickness of the adhesion line | ≤ 95 μm |
CTM 0137 | Tensile strength | 3.7 MPa |
CTM 0137 | Elongation | 50% |
CTM 0243 A | Accession –
Lip cut; Al anodized A5052P Breaking mode – adhesive |
2.9 MPa
≥ 90% |
CTM 0114 | Dielectric strength at 1 mm | 22 kV/mm |
CTM 1163 | Thermal conductivity by transient method | 3.3 W/mK |
DIN2 51007 | Heat capacity, volumetric at 25°C
Heat capacity at 25°C |
2.63 MJ/m3K
0.88 J/gK |
ASTM3 E 831 | Linear CTE (TMA -50 to 200°C) | 93.6 ppm/K |
Properties of the heat-conductive adhesive DOWSIL™ TC-2035 CV
Thermal and electrical properties
- Thermal conductivity: 3.3 W/mK
- Dielectric strength: 22 kV/mm
- Heat capacity at 25°C: 0.88 J/gK
- Linear CTE (-50 to 200°C): 93.6 ppm/K.
Adhesion without primer on selected substrates
DOWSIL™TC-2035 CV Adhesive achieves cohesion on most common aluminum substrates without the use of any primer.
Coefficient of thermal expansion (CTE)
Silicone curing mechanism
Thermally conductive material with additional polymerization
- Low polymerization start temperature with start between 74.6 and 77.2°C and peak between 77.9 and 80.6°C
- No polymerization by-products
- Minimal shrinkage.
Pot life and curing profile
Profile pot life | |||||
Initial | 120
minutes |
180
minutes |
210 minutes | 240 minutes | |
1 (1/s)
Pa-s |
323 | 372 | 460 | 566 | 741 |
Viscosity variation | 15% | 42% | 75% | 130% |
Stable viscosity
The viscosity of DOWSIL™ TC-2035 CV heat-conductive adhesive remains completely stable throughout its shelf life. The presence of sedimentation or separation is almost nonexistent.
High purity material
Total D4-D6 content less than 100 ppm | |||
(Unit: µg/g) | D4 | D5 | D6 |
Lot 1 | 18.90 | 5.40 | 2.40 |
Lot 2 | 20.20 | 5.50 | 2.50 |
Media | 19.50 | 5.45 | 2.45 |
Ionic species less than 5 ppm | |||
Element | DOWSIL™
CV adhesive TC-2035 (1) |
DOWSIL™
TC-2035 CV Adhesive (2) |
DOWSIL™
Adhesive TC-2035 CV (3) |
Results of cation measurement | |||
Sodium | <2.64 | <2.64 | <2.64 |
Potassium | <1.13 | <1.13 | <1.13 |
Results of anion measurement | |||
Fluorine | <0.32 | <0.32 | <0.32 |
Chlorine | <3.33 | <3.33 | <3.33 |
Bromine | <0.58 | <0.58 | <0.58 |
Processing
- BLT minimum ≤ 95 µm
- Mixing ratio 1:1
- Polymerization profile 15 minutes at 115°C
- Pot life 3 to 4 hours at 25°C
- Fast dosage
- Extrusion speed Part A: 33 g/min
- Extrusion speed Part B: 52 g/min
Tolerance of mixing ratio
Properties | Interval | Initial mixing ratio
A/B=100/100 |
Initial mixing ratio
A/B=115/100 |
Initial mixing ratio
A/B=100/115 |
Viscosity of the mixture | 1700 ± 500 Pa-s | 1734 | 1629 | 1555 |
330 Pa-s ± 150 Pa-s | 348 | 338 | 332 | |
150 +- 40 Pa-s | 152 | 151 | 150 | |
Viscosity variation (2 hours) | 20% increase | 3 | 7 | 3 |
Thermal conductivity | 3.4 W/mK +/- 0.3 W/mK | 3.4 | 3.3 | 3.3 |
Tensile strength | 2.9 MPa -0.7/+ 1.5 MPa | 3.6 | 3.1 | 3.8 |
Tensile properties,
elongation at break |
55% – 10 /+ 25% | 47 | 56 | 49 |
Linear strain limit | 5% +- 0.5% | 5.2 | 5.0 | 5.0 |
Polymerization parameters | ||||
Specific density | 3.00 +/- 0.1 g/cm³ | 2.99 | 2.99 | 2.99 |
Shore hardness | 28 +/- 10 Shore D | 38 | 33 | 37 |
Tensile and shear strength | A5052P
2.3 N/mm² – 0.5 /+ 0.9 N/mm² |
03.04 | 2.56 | 3.15 |
Overview of DOWSIL™ TC-2035 CV heat-conductive adhesive
For more information about DOWSIL™ TC-2035 CV, you can visit the product page or contact our technical experts, who will help you optimize your applications.