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🧭 Where you are: mascherpa.it » Blog » DOWSIL™ TC-2035 CV: The new heat-conductive adhesive for automotive electronic assembly.

The new DOWSIL™ TC-2035 CV adhesive is a high thermal conductivity adhesive that cures rapidly at low temperature and provides excellent stability at room temperature for automotive electronic assembly applications. This innovative technology is helping to power the next generation of low-carbon mobility.

Product Introduction

The new high-performance heat-conductive adhesive offers a combination of outstanding properties: a high thermal conductivity of 3.3 W/m.K for more efficient heat transfer, a low bond line thickness of ~50% for minimal impact on component size, a high elongation at break of ~50% for flexibility and resilience, and easier dispensing that allows convenient application.
DOWSIL™ TC-2035 CV, moreover, offers fast bonding by curing at 115°C/15 minutes, primerless adhesion (on selected substrates) to simplify assembly, a long shelf life of 12 years at or below 35°C for extended storage, and a low volatile content of <100 ppm, which ensures environmental safety.

In particular, DOWSIL TC-2035 excels in several automotive applications, including:

Comparison of DOWSIL™ TC-2035 CV and DOWSIL™ TC-2035

Properties DOWSIL™

CV Adhesive TC-2035

DOWSIL™

TC-2035 Adhesive

Benefits
Color Reddish brown Reddish brown
Thermal Conductivity (W/mK) 3,3 3,0 High thermal conductivity
Specific gravity – cured 3,00 03,07
Initial extrusion speed (rpm) Part A: 33

Part B: 52

Part A: 43

Part B: 58

High dosing speed – higher productivity
Shelf life (months) 12 6 Lower scraps
Storage conditions ≤ 35°C ≤ 25°C Lower scrap and energy consumption
Pot life (now) 3,5 5 Simpler processing
Durometer (Shore D) 33 38
Tensile Strength (MPa) 37 38 Increased reliability
Elongation (%) 50 55 Flexible joints, less material needed
Adhesion failure mode (%) ≥90% Cohesive

*Al – A5052P, anodized

≥90% Cohesive

*Al – A1050P

Good adhesion without primer
Shear Adhesion of Foil (MPa) 2.9; *Al – A5052P, anodized 2.6; *Al – A1050P Stronger adhesion
Polymerization status 15 minutes at 115°C 30 minutes at 125°C Faster processing less energy consumption

DOWSIL™ adhesive TC-2035 CV

Table 1:

Test Properties
CTM1 0176 B Two parts
CTM1 0176 B Color: Part A – WhitePart B – Reddish brown
CTM 0022 B Density: Part A and Part B – 3.0g/cm3
Mixing ratio – 1:1
Cure time at 115°C – 15 minutes

Table 2:

Test Properties Result
CTM 1094 C Viscosity at 1 (1/s)

Part A

Part B

350 Pa.s

290 Pa.s

CTM 1094 N Viscosity at 1 (1/s) mixed 345 Pa.s
CTM 1393 Minimum thickness of the adhesion line ≤ 95 μm
CTM 0137 Tensile strength 3.7 MPa
CTM 0137 Elongation 50%
CTM 0243 A Accession –

Lip cut; Al anodized A5052P

Breaking mode – adhesive

2.9 MPa

≥ 90%

CTM 0114 Dielectric strength at 1 mm 22 kV/mm
CTM 1163 Thermal conductivity by transient method 3.3 W/mK
DIN2 51007 Heat capacity, volumetric at 25°C

Heat capacity at 25°C

2.63 MJ/m3K

0.88 J/gK

ASTM3 E 831 Linear CTE (TMA -50 to 200°C) 93.6 ppm/K

Properties of the heat-conductive adhesive DOWSIL™ TC-2035 CV

Thermal and electrical properties

  • Thermal conductivity: 3.3 W/mK
  • Dielectric strength: 22 kV/mm
  • Heat capacity at 25°C: 0.88 J/gK
  • Linear CTE (-50 to 200°C): 93.6 ppm/K.

Adhesion without primer on selected substrates

DOWSIL™TC-2035 CV Adhesive achieves cohesion on most common aluminum substrates without the use of any primer.

Coefficient of thermal expansion (CTE)

Silicone curing mechanism

Thermally conductive material with additional polymerization

  • Low polymerization start temperature with start between 74.6 and 77.2°C and peak between 77.9 and 80.6°C
  • No polymerization by-products
  • Minimal shrinkage.

Pot life and curing profile

Profile pot life
Initial 120

minutes

180

minutes

210 minutes 240 minutes
1 (1/s)

Pa-s

323 372 460 566 741
Viscosity variation 15% 42% 75% 130%

Stable viscosity

The viscosity of DOWSIL™ TC-2035 CV heat-conductive adhesive remains completely stable throughout its shelf life. The presence of sedimentation or separation is almost nonexistent.

High purity material

Total D4-D6 content less than 100 ppm
(Unit: µg/g) D4 D5 D6
Lot 1 18.90 5.40 2.40
Lot 2 20.20 5.50 2.50
Media 19.50 5.45 2.45
Ionic species less than 5 ppm
Element DOWSIL™

CV adhesive TC-2035 (1)

DOWSIL™

TC-2035 CV Adhesive (2)

DOWSIL™

Adhesive TC-2035 CV (3)

Results of cation measurement
Sodium <2.64 <2.64 <2.64
Potassium <1.13 <1.13 <1.13
Results of anion measurement
Fluorine <0.32 <0.32 <0.32
Chlorine <3.33 <3.33 <3.33
Bromine <0.58 <0.58 <0.58

Processing

  • BLT minimum ≤ 95 µm
  • Mixing ratio 1:1
  • Polymerization profile 15 minutes at 115°C
  • Pot life 3 to 4 hours at 25°C
  • Fast dosage
    • Extrusion speed Part A: 33 g/min
    • Extrusion speed Part B: 52 g/min

Tolerance of mixing ratio

Properties Interval Initial mixing ratio

A/B=100/100

Initial mixing ratio

A/B=115/100

Initial mixing ratio

A/B=100/115

Viscosity of the mixture 1700 ± 500 Pa-s 1734 1629 1555
330 Pa-s ± 150 Pa-s 348 338 332
150 +- 40 Pa-s 152 151 150
Viscosity variation (2 hours) 20% increase 3 7 3
Thermal conductivity 3.4 W/mK +/- 0.3 W/mK 3.4 3.3 3.3
Tensile strength 2.9 MPa -0.7/+ 1.5 MPa 3.6 3.1 3.8
Tensile properties,

elongation at break

55% – 10 /+ 25% 47 56 49
Linear strain limit 5% +- 0.5% 5.2 5.0 5.0
Polymerization parameters
Specific density 3.00 +/- 0.1 g/cm³ 2.99 2.99 2.99
Shore hardness 28 +/- 10 Shore D 38 33 37
Tensile and shear strength A5052P

2.3 N/mm² – 0.5 /+ 0.9 N/mm²

03.04 2.56 3.15

Overview of DOWSIL™ TC-2035 CV heat-conductive adhesive

For more information about DOWSIL™ TC-2035 CV, you can visit the product page or contact our technical experts, who will help you optimize your applications.