Key points of the article
- Mascherpa will be present at Focus on PCB 2026 on May 13-14 in Vicenza, the leading event for the printed circuit board industry.
- We will present advanced solutions for electronic protection with a focus on silicones and Low Pressure Molding, a new technology that enables encapsulation of electronic components in a rapid, controlled e repeatable.
- Visitors will be able to explore materials, processes, and selection criteria to improve the reliability and performance of PCB printed circuit boards.
- It will be possible to discover and explore Low Pressure Molding as an alternative to potting and traditional solutions.
- Cabiotec will be present at the booth with technologies for inspection, analysis, and quality control.
Our Mascherpa team is proud to announce our participation once again this year at Focus on PCB. In this edition, we will bring an even more solution-oriented approach to technical solutions and real-world applications, with the goal of supporting those working on electronic device protection.
Focus on PCB: The Leading Trade Fair for the Printed Circuit Board Industry
On May 13 and 14, 2026, Focus on PCB returns, the only European trade fair entirely dedicated to the printed circuit board and assembly supply chain. The event, which will take place at the Vicenza Expo Center, represents a direct exchange between companies, suppliers, and professionals in the electronics sector.
Over the two days, Focus on PCB 2026 will host exhibitors (including Mascherpa), conferences e in-depth sessions on advanced materials, production processes, reliability e protection for PCB printed circuit boards.
A technical environment where the focus is not only on products, but on applications, challenges, and concrete solutions.
Where to Find Us at Focus On PCB 2026
Once again this year, Mascherpa will be present with a dedicated booth where you can explore materials, technologies, and applications related to electronic protection of PCB printed circuit boards.
When: May 13-14, 2026
Where: Vicenza
Location: Hall 7 – Booth C44/D43
Mascherpa at Focus on PCB 2026: Materials and Technologies for Electronic Protection
Mascherpa will participate at Focus on PCB 2026 to present solutions dedicated to electronic device protection, with a focus on materials and technologies that directly impact the reliability and long-term stability of printed circuit boards.
At our booth, visitors will be able to explore two main areas:
- the importance of silicones in the production of electronic devices,
- Low Pressure Molding based on hot melt polymers and overmolding systems.
Silicones for Electronic Protection: Materials and Selection Criteria
Silicone materials are often considered one choice “among others.” In reality, they become critical when operating conditions become variable or demanding.
During the trade fair, it will be possible to explore their use in electronic device protection, with particular attention to:
- differences between silicones and alternative materials,
- behavior under thermal and environmental stress,
- resistance to moisture, vibrations, and chemical agents,
- selection criteria based on the application.
Through collaboration with leading international manufacturers, Mascherpa offers advanced silicone solutions such as DOWSIL products, ensuring high performance and reliability even in demanding operating conditions.
Low Pressure Molding: A New Technology for Electronic Encapsulation
Alongside silicones, Mascherpa introduces Low Pressure Molding, a technology based on hot melt polymers and overmolding systems.
This solution enables encapsulation of electronic components in a rapid, controlled, and repeatable manner, representing an alternative to potting processes and traditional solutions.
The integration between material and process is one of the distinctive elements of the technology:
- hot melt polymers developed by SIPOL,
- overmolding systems by TECNO INCOLLAGGI (Tecnostar).
This integration enables:
- protection from water, dust, vibrations, and thermal stress,
- high chemical and mechanical resistance,
- insulating properties and long-term stability,
- precise control of the process through volumetric pump and PLC,
- reduction of waste and product stability,
- reduced cycle times and lower energy consumption,
- complete management of injection parameters.
The result is an integrated system that combines material and process, useful when it is necessary to streamline the production cycle and improve result stability.
At the Booth Together with Our Partners from Cabiotec
Also present at our booth will be our partner Cabiotec, with solutions for:
- automated optical inspection (AOI),
- X-ray analysis,
- digital microscopy,
- PCB cleaning.
Visit Us at Focus on PCB 2026
If you work in the printed circuit board or electronics sector and want to explore materials and technologies for electronic device protection, visit us at our booth at Focus on PCB 2026.
Our team will be available to discuss real-world applications, explain the characteristics of silicone materials, and show you firsthand the potential of Low Pressure Molding.
Download the technical guide on silicones and discover the Low Pressure Molding solution for protection of electronic components. Additionally, contact us if you would like to request a Low Pressure Molding demo and obtain your ticket for Focus on PCB.
