This article is about thermally conductive encapsulants
✅ What they are
Advanced materials for heat dissipation and protection of electronic components.
✅ Advantages
High thermal conductivity, mechanical protection, resistance to extreme conditions.
✅ Applications
Automotive, renewable energy, industrial electronics, aerospace.
✅ Advanced solutions
Mascherpa offers a range of Dowsil products to ensure efficiency and reliability.
✅ How to choose the right product
Analyzes thermal dissipation requirements and operating conditions.
Did you know that inefficient thermal management can reduce the life of electronic devices by up to 50 percent? Thermally conductive encapsulants are an advanced solution to dissipate heat and protect electronic components.
In the rapidly changing landscape ofadvanced electronics andindustrial engineering, the thermal management has become a crucial challenge for designers and manufacturers. With increasingly compact and powerful components, dissipating heat efficiently is critical to ensure high performance and long-term reliability.
What are thermally conductive encapsulants
The thermally conductive encapsulants represent an advanced class of thermally conductive materials designed to meet the needs of thermal management in modern electronic systems. These innovative, flowable materials are ideal for high-volume automated manufacturing, offering a lightweight and flexible alternative to pre-polymerized materials for thermal interface.
Unlike other thermal management, encapsulants combine thermal conductivity and advanced protection. They are special silicone-based compounds that are precisely applied to electronic circuits to improve heat transfer and protect sensitive components from environmental stresses.
Advantages of thermally conductive encapsulants
The advantages of these thermally conductive products and materials go beyond simple heat dissipation:
- Low viscosity: facilitatesapplication to complex geometries, optimizing production processes and ensuring uniform coverage.
- Dual functionality: they offer effective thermal dissipation combined with advanced mechanical protection, increasing the life of electronic components.
- Resistance to extreme conditions: operate between -40 °C and 200 °C, with excellent resistance to moisture, oxidation and thermal shock.
- Primerless application: many modern formulations provide effective adhesion without primer, reducing production time and costs.
Sectors in which thermally conductive encapsulants are applied
Due to their versatility, the thermally conductive encapsulants are widely used in high-tech industries, including:
In the automotive industry and electric vehicles, these materials are critical to:
In solar energy systems they are used for:
- Protection of photovoltaic panels
- Thermal management of power inverters
- Ensuring stable performance in variable weather conditions
In critical power modules, these materials offer:
- Efficient thermal management
- Increased operational reliability
- Protection against environmental degradation
For aerospace, thermally conductive encapsulants are essential for:
- Avionic systems
- Satellite components
- Communication equipment
Advanced solutions for thermal efficiency in electronic devices
Mascherpa is a benchmark in the supply of thermal conductive insulation materials, offering tailor-made solutions forelectronics, l’automotive and theaerospace industry. We offer a wide range of products designed to improve heat dissipation, ensuring reliability and durability to electronic devices.
Choosing the right heat-conductive encapsulant is critical to ensuring a thermal management optimum and prevent overheating of electronic components, thus avoiding performance drops or premature failures. For this, Mascherpa provides qualified technical support, helping companies identify the best solution for their application needs.
On our site you will be able to find the following thermal encapsulants:
- DOWSIL™ TC-6011 → Optimized for lightweight projects, offers exceptional fluidity and thermal conductivity.
- DOWSIL™ TC-6020 → Designed for high-power systems with higher dissipation requirements.
- DOWSIL™ EI-2888 → Primerless silicone encapsulant designed for sensitive electronic applications, offers high transparency and protection against environmental agents.
- DOWSIL™ CN-8760 → Thermally conductive encapsulant ideal for devices requiring efficient heat dissipation, combining thermal conductivity and mechanical flexibility.
- DOWSIL™ EE-3200 → Low-voltage silicone encapsulant to reduce stress on electronic components, providing reliable protection and long operating life.
Thanks to a wide range of heat-conductive adhesives, solutions for thermal management and specific materials for thethermal interface, Mascherpa helps companies and designers improve the thermal efficiency of their devices.
To find out more about heat-conductive encapsulants, contact Mascherpa experts and find the ideal product for your applications.
