Key points of the article
- The partnership between Mascherpa, SIPOL and TECNO INCOLLAGGI introduces a complete system for electronic encapsulation based on Low Pressure Molding.
- The LPM process enables PCB protection and sensitive components through molding at low pressure without damaging them.
- The e-TECHNIPOL® materials ensure protection from external agents, chemical resistance and mechanical stability over time.
- The Tecnostar Overmolding system enables precise control of the process, waste reduction and consistent quality of the product.
- The Low Pressure Molding process can be observed directly in operation, highlighting its advantages, materials, and application areas.
At Focus on PCB 2026, Mascherpa presents the partnership with SIPOL e TECNO INCOLLAGGI to introduce a complete system of encapsulation based on technology of Low Pressure Molding (LPM).
The objective of the partnership is to deliver an integrated approach that combines:
- high-performance hot melt materials,
- low-pressure molding process,
- control of process parameters.
A solution designed to ensure protection, stability and consistent quality in electronic encapsulation processes for PCBs.
Index
- What is Low Pressure Molding
- Low Pressure Molding VS Traditional Potting
- e-TECHNIPOL® materials for electronic encapsulation
- TECNO INCOLLAGGI: Low Pressure Molding process control
- An integrated system: material and process in a single solution
- Low Pressure Molding Technology: Watch the Process in Action
What is Low Pressure Molding
Low Pressure Molding is an encapsulation technology that enables the protection of electronic components, such as PCBs and connectors, through molding at low pressure that does not damage sensitive parts.
The process is based on the use of single-component thermoplastic adhesives that are:
- melted,
- injected into the mold,
- solidified directly on the component.
Low Pressure Molding VS Traditional Potting
Compared to traditional systems of potting or two-component casting, Low Pressure Molding enables:
- a faster production cycle,
- a significant reduction in material used,
- a lower weight of the final component,
- the elimination, in some cases, of structural elements such as the housing.
The reduction in process pressures also enables the use of aluminum molds, with advantages in terms of thermal control and production costs.
e-TECHNIPOL® materials for electronic encapsulation
Within the partnership, SIPOL provides the material foundation of the process through the e-TECHNIPOL® range, hot melt adhesives developed for electronic encapsulation applications.
These materials, available in polyamide-based and polyester formulations, ensure:
- protection from water, dust and vibrations,
- resistance to low and high temperatures,
- chemical resistance to oils, solvents and cleaning agents,
- insulating properties for electronic components,
- high mechanical properties, particularly flexibility at low and high temperatures.
Characteristics of e-TECHNIPOL® products used in Low Pressure Molding
Among the relevant technical characteristics:
- waterproofing up to IP68,
- compliance with RoHS and REACH,
- absence of solvents (VOC),
- high flexibility without brittleness on impact.
The materials are designed to be molded directly onto PCBs and electronic components, enabling complete protection without compromising the integrity of the device.
TECNO INCOLLAGGI: Low Pressure Molding process control
The process component is entrusted to TECNO INCOLLAGGI through the Tecnostar Overmolding System, a machine designed for Low Pressure Molding applications with polyamide hot melt adhesives.
The system integrates:
- melter with integrated pressing plate,
- high-precision gear volumetric pump,
- complete control of parameters via PLC,
- automatic injector,
This configuration enables:
- accurate control of injection times and dwell times,
- stability of the material during the process,
- consistent quality of the finished product.
What the Tecnostar system guarantees
From an operational standpoint, the system guarantees:
- reduced oxidation of the resin inside the melter,
- no alteration of material color,
- controlled melting of only the required quantity,
- reduction of production waste,
- reduced machine startup times,
- lower energy consumption.
The automated management and parameter control enable a repeatable and stable process, a fundamental element in electronic applications.
An integrated system: material and process in a single solution
The collaboration between Mascherpa, SIPOL and TECNO INCOLLAGGI results in an integrated system in which materials and process are designed to work together.
The integration between material formulation, process parameters and injection technology enables:
- high encapsulation quality,
- uniform protection of components,
- reduction of production variability.
This approach is particularly relevant in applications where reliability and repeatability are critical, such as:
- encapsulated PCBs,
- connectors,
- sensors,
- electric micromotors,
- control units,
- components subject to vibrations or aggressive environments.
Low Pressure Molding Technology: Watch the Process in Action
The technology developed in collaboration between Mascherpa, SIPOL, and TECNO INCOLLAGGI enables protection of electronic components and PCB boards through a low-pressure molding process designed to ensure reliability and operational continuity.
To learn more about how the system works and see the process applied directly on an industrial machine, you can watch the video recorded during a live demonstration.
Through Low Pressure Molding, it is possible to:
- analyze the encapsulation process;
- evaluate materials and configurations;
- explore applications and specific use cases.
Mascherpa, together with its technology partners, supports companies in identifying the most suitable solution for their electronic protection needs. For more information contact our experts or download our technical data sheets.
