Mascherpa at Focus on PCB 2026: The Best of the Show
Key points of the article At Focus on PCB 2026, Mascherpa presented the Low Pressure Molding system developed with SIPOL and TECNO INCOLLAGGI. At the show, it was possible to see the Tecnostar Overmolding system applied to electronic encapsulation of PCBs. Among the solutions on display were also silicones for…
MascherpaJune 11, 2026

