Low Pressure Molding: SIPOL and TECNO INCOLLAGGI together with Mascherpa at Focus on PCB.
Key points of the article The partnership between Mascherpa, SIPOL and TECNO INCOLLAGGI introduces a complete system for electronic encapsulation based on Low Pressure Molding. The LPM process enables PCB protection and sensitive components through molding at low pressure without damaging them. The e-TECHNIPOL® materials ensure protection from external agents,…
MascherpaMay 5, 2026





