The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

DOWSIL™ 5515

  • Low density
  • Room temperature or heat-accelerated polymerization
  • Non-sagging, stable even on vertical surfaces
  • Soft and deformable material with stress relief function
  • Slightly tacky surface after curing
  • No exotherm during curing

Additional information

Product Type
Brand
Technology
Dielectric strength (kV/mm)
Viscosity
Color
Polimerizzazione
Tempo asciugatura al tatto
UL94 self-extinguishing
Range termico operativo
Thermal conductivity
Certifications
Applications , ,
Industries ,
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